Boron Nitride Composite Ceramics

Boron Nitride Composite Ceramics
Details:
Boron Nitride Composite Ceramics has high thermal conductivity, high insulation, good chemical stability, high thermal shock stability, etc. It can be processed to the required shape and size as needed.
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Description
Technical Parameters
172342830634661
17234296007296

 

Product Features and Advantages

 

1

Unique process formula, optimized composition structure, the material has excellent thermal shock resistance, corrosion resistance, creep resistance and other properties.

2

Adopting the internationally advanced vacuum hot pressing sintering method, the material structure is delicate, the density is high, and it has excellent physical properties.

3

It does not react in wet or stain with molten metal at high temperatures, and is widely used in various applications in contact with molten metal.

 

Boron Nitride Composite Ceramics Packaging and Transportation

 

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Product packaging is in accordance with the "Technical Specifications" or industry standards;

 

The packaging of Boron Nitride Composite Ceramics meets the characteristics and performance of the product itself, including sufficient to prevent the product from moisture, rain, rust, corrosion, and shock, etc., and can accept multiple handling, loading and unloading, and transportation;

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Product Process and Production Process

 

The production process of Boron Nitride Composite Ceramics includes key steps such as raw material selection, boron nitride powder preparation, molding, sintering treatment, and post-processing and testing. Each step requires strict control of process parameters and operating conditions to ensure the quality and performance of the final product. With the advancement of technology and continuous optimization of processes, the production process of Boron Nitride Composite Ceramics will continue to be improved and perfected to provide better material support for the development of various industries.

 

Parameters Table

 

Category

 

T

E1

E2

L

N

S

Main Ingredients

 

BN+TiB2+AlN

BN+ZrO2+SiC

BN+ZrO2+SiC

BN+AlN

BN+Si3 N4

BN+ SiO2

density

g/cm3

3.01

2.3-2.35

2.6-2.7

2.8-2.9

2.5-2.6

2.1-2.15

 

Leeb hardness

HL

 

570-620

520-550

≥650

650-680

700-750

Bending strength

Mpa

155

160

150

250-300

280

75

Thermal expansion coefficient (25℃-1200℃)

(10-6/K)

6.0-7.0

2.0-3.0

3.0-5.0

4.0-5.0

2.5-3.0

2.5-3.0

Thermal conductivity (room temperature)

W/mk

40

15

30

65

45

20

Maximum operating temperature

Air

950℃

900℃

900℃

950℃

950℃

1000℃+

Inert atmosphere

2000℃

1700℃

1700℃

2000℃

1700℃

1000℃+

Room temperature resistivity

Ω .cm

250-1000

> 1012

> 1012

> 1014

> 1014

> 1014

 

 

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